2021 | vol. 69 | nr. 2 | art. 6

Miniaturisation of Electronic Components and the Problem of Device Overheating

Titu-Marius I. BÄ‚JENESCU
Abstract
With the ever-increasing rate of data generation and communication, as well as the constant push to reduce the size and costs of industrial converter systems, the power density of electronics has risen. Consequently, cooling, with its enormous energy and water consumption, has an increasingly large environmental impact, and new technologies are needed to extract the heat in a more sustainable way-that is, requiring less water and energy. Embedding liquid cooling directly inside the chip is a promising approach for more efficient thermal management. However, the electronics and cooling are treated separately, leaving the full energy-saving potential of embedded cooling untapped. By removing the need for large external heat sinks, this approach should enable the realization of very compact power converters integrated on a single chip.
Keywords: Electronics, photonics, microfluidics, thermal packaging, thermal management, cooling of ICs
To cite this article: BÄ‚JENESCU I. Titu-Marius, “Miniaturisation of Electronic Components and the Problem of Device Overheating”, in Electrotehnica, Electronica, Automatica (EEA), 2021, vol. 69, no. 2, pp. 53-58, ISSN 1582-5175.
https://doi.org/10.46904/eea.21.69.2.1108006
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