2019 | vol. 67 | nr. 2 | art. 10

Failures Analysis of Microcircuits
Titu-Marius I. BĂJENESCU
Abstract
For failure analysis of integrated circuits it is necessary to open and delayer a chip layer by layer in order to find a hidden defect or defects. It is necessary to determine the cause of failure to prevent future occurrence, and/or to improve the performance of the device. Increased circuit densities, smaller feature sizes and ever increasing multilayer technologies have created many challenges for failure analysis engineers.
Keywords: Microcircuits, reliability, failure, failure analysis, failure mode, failure mechanism
To cite this article: BĂJENESCU I. T.-M., “Failures Analysis of Microcircuits”, in Electrotehnica, Electronica, Automatica (EEA), 2019, vol. 67, no. 2, pp. 84-88, ISSN 1582-5175.

 

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